Gallery
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Microchip X-Ray
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Cracked Solder Ball
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Cracked Solder Ball
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Cracked Solder Ball
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Cracked Solder Ball
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Void measurement by X-ray
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Cracked Solder Ball
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Solder Ball Cracked through Intermetallic Compound Layer
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Ball Grid Array, Top Down Grind
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Dye and Pull
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Dye and Pull
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Cracked Solder on Through Hole Component
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Cracked Solder Ball
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Battery Terminal Cross Section
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Battery Terminal Cross Section
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Battery Terminal Cross Section
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Tin Whisker
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Tin Whisker
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Laminate Condition - Measles
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Solder Joint Surface Crack
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LED Cross Section
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Brightfield LED Solder Joint Cross Section
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Darkfield LED Solder Joint Cross Section
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Brightfield LED Solder Joint Cross Section
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Darkfield LED Solder Joint Cross Section
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Corroded Mounting Screw
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Connector Legs From Whisker Inspection
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Non-Wetted Solder Joint
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Solder Void
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Corroded Through Hole Component
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Component Corrosion
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Corroded Pin
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Cracked Solder Ball
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Ceramic Resistor Overview
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Ceramic Resistor Microsection
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Ceramic Resistor Solder Joint Microsection
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Ceramic Resistor Solder Joint Microsection
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Etched Copper Plated Via Cross Section
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Etched Copper Plated Via Cross Section
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Etched Copper Plated Via Cross Section
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Etched Copper Plated Via Cross Section
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Dye and Pulled BGA Component - Board Side
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Dye and Pulled BGA Component - Chip Side
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Dye and Pulled BGA Component - Board Side Macro View
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Damaged Board Surface
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Solder Ball Crack
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Solder Ball Crack
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BGA Component Microsection Overview
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BGA Component Microsection Overview
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J-Lead Component Solder Crack
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Gold wire bond inside an IC
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Microprocessor X-Ray
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PCB X-Ray
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Poorly Wetted Jumper Wire
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Solder Ball Crack in SEM
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Resistor SEM Electron Micrograph
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Dendrites
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Dendrites with through-board illumination
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Void in a solder ball
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Resistor smashed in service
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Microprocessor X-Ray
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PTH wall
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Solder crack
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Tombstoned capacitor
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BGA with glass top layer