SEM Services - Scanning Electron Microscope
We have a large chamber Hitachi scanning electron microscope capable of secondary electron imaging, back scattered electron imaging, and energy dispersive spectroscopic analysis (EDS or EDX). We use this tool in the evaluation of intermetallic layers, analysis of solder compositions, contamination studies, and failure analysis. We also sell SEM services on an hourly basis. You can hand off your SEM work to us, or you can sit with us and direct an entire investigation.
Secondary Electron - Dimples
SEM Services
We have a large chamber Hitachi scanning electron microscope capable of secondary electron imaging, back scattered electron imaging, and energy dispersive spectroscopic analysis (EDS or EDX). We use this tool in the evaluation of intermetallic layers, analysis of solder compositions, contamination studies, and failure analysis. We also sell SEM services on an hourly basis. You can hand off your SEM work to us, or you can sit with us and direct an entire investigation.
Back Scattered Electron image of intermetallic layer
Description of Scanning electron microscopy
Scanning electron microscopy provides a greater depth of field and higher magnifications than optical microscopy. These advantages are especially useful for examination of fracture surfaces, which tend to have tiny features distributed on a highly three dimensional surface. The same advantages make SEM examination indispensable for tin whiskers.
High magnification SEM imaging is also useful for examination of microstructural features of polished samples, such as intermetallic layers, and for verification of cracking.
Secondary Electron image of brittle fracture surface
EDS analysis provides a semi-quantitative analysis of metallic materials. The output is a list of elements and a weight percentage of each. The best quantification is achieved when the examined surface is flat and smooth, but reasonably close analyses can be achieved on contoured surfaces as well. EDS analysis can be performed on extremely small particles, making it useful for determining the nature, and possibly the source, of contaminating debris.
EDS is not a good analysis technique for non-metallic materials such as polymers and greases. And while EDS is good for evaluating the composition of particulate debris, it is usually not suitable for evaluation of ionic contamination.
Deliverables
If you engage us for analysis of solder, intermetallic layers, fracture analysis, tin whiskers, or other SEM activities, we will quote a defined scope of work with the deliverables. If you choose to contract us for SEM work on an hourly basis, all images and analyses acquired during an SEM session are included in the hourly rate. We can supply a written report for an additional 1/2 to 1 hour. CLICK HERE for an example report.
What to do next
Contact us by phone or email and tell us what material or item you would like examined (circuit board, polished mount, fracture surface, etc.). Also tell us what you are trying to learn or verify. We will tell you if SEM examination is the best way to reach your objective. Then, decide if you would like us to perform this evaluation independently or if you would like to be present to observe or direct the evaluation.